automatická bga rework stanice Česká republika

Automatic BGA rework station – the important tool for PCB assembly Seven aspects of the solution. Since a PCB fabrication is never complete without attaching electronic components to the PCB, and the ball grid array is a basic component of the board, an automatic BGA rework station should be a critical solution in the screenplay. BGA, to be specific, is an integrated circuit with tiny balls underneath it, hundreds or thousands of which are used for obtaining a connection with a PCB. Something as small as two BGA balls linked together wrong can impact the functionality of the one-to-two square meter board completely. An automatic BGA rework station, which is a specialized device for this predicament, works by enabling the manipulation of heat to weaken the solders behind the BGA and then remove or replace it if required. Although its working principles are not fundamentally different from a human operator’s, there is one thing that they do well above us: they give their users greater precision and control. Operational steps. Whatever is said about the sophistication of the instruction process, any yet another automated solution comprises fundamentally the same components. More specifically, each automatic BGA rework station consists of two parts: the heating device and hot air nozzle , the latter is used to direct heat on the entire soldering spot around every Ball Grid Array , and a remove vacuum pump since removing gasses/ vapors and dust is essential. Additional components are also possible: a control panel or software interface to regulate the temperature and timing of all stages.. Workflow stages. The process consists of some simple, iterative steps:Reflection of the application point on the rework station and aligning the nozzle to the BGA for alignment with the PCB ;False preheat cycle to increase pattern BGA;As the solder is heated up to its melting point, the process does so delicately, without generating factors that will damage other components, or the PCB itself;the BGA and excess solder being removed from the PCB using the vacuum pump;Cleaning the PCB for the cleaned BGA chip.

    New BGA set on top of some previous reflow cycles to flow/push it down into the PCB.

    Remember! there are a lot of variations and settings depending on BGA, PCB etc... it means how you might require proper training or expertise to get comfortable with working on an automatic bga rework station bed.

    Why choose NeoDen Technology automatic bga rework station?

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