Description：

1. Selective spray flux: according to the PCB structure, the user can edit the program to plan the X-Y movement path of the spray flux.

2. Selective wave soldering: Selectively soldering the PCB according to the user's program path X-Y-(Z).

3. Tin furnace: patent square nozzle design, furnace bladder anti-corrosion treatment.

High temperature motor drive, fully enclosed impeller, low design.

Electromagnetic pump tin stove is optional.

4. Manipulator + motion control: the movement of PCB relative to tin stove adopts X-Y-(Z) right-angle manipulator, servo/stepper motor drive.

Ball screw + linear guide way.

Motion control card, path and add/subtract speed control.

5. Preheating: Preheating temperature, preheating time, preheating path program can be adjusted, users can flexibly use infrared + hot air preheating process.

6. Nitrogen system: with nitrogen pressure adjustment, flow control, advance heating, nitrogen cap. (option)

7. Equipment operation: single person (or robot) to take and put the board operation.

Specifications：