Description：

1. Test mode: Optimized detection technology covering the whole circuit board. Jointed board and multiple marks, with Bad Mark function.

2. Detection type: Component defects such as whether there is solder paste, offset, insufficient solder, excess solder, open circuit and contamination;

mounting defects such as missing part, offset, skewing, tombstone, mounting on side, turnover, wrong parts, damage and reversal, etc.;

solder joint defects such as excess solder, insufficient solder, pseudo soldering, and solder bridge, etc.;

and PCB defects such as copper foil contaminated, black pad, de-lamination, copper foil missing, and oxidation, etc.

3. Image recognition: Automatically set the parameters (e.g. shift, polarity, short circuit, etc.) according to different inspection requirements.

4. SPC statistical function: Record the test data in the whole process and carry out statistics and analysis, and production status and quality analysis can be viewed in any area.

5. Camera and lighting system: Full-color high-speed digital CCD camera, with resolution of lens of 10, 15, 18 and 20um, three-channel RGB light source

6. Driving system: AC servomotor system, precision grinding ball screw

Specifications：